Semiconductor

Defect Detection – Lithography

A classifier system is utilized to forecast the likelihood of the occurrence of a specific defect mode in patterning, relying on two consecutive measurements.

• Scanner exposure dose
• Focus.

During the post-etch inspection phase, it is often the case that this specific defect mode is identified. However, by utilizing the scanner data that is accessible, we can predict the occurrence of the defect right after the exposure step. This proactive approach allows us to optimize the rework procedure and mitigate any potential loss in yield.